Integrating copper at the nanometer length scale with Sn-3·5Ag solder to develop high performance nanocomposites

Integrating copper at the nanometer length scale with Sn-3·5Ag solder to develop high performance nanocomposites

10.1179/174328408X378582

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Bibliographic Details
Main Authors: Babaghorbani, P., Nai, S.M.L., Gupta, M.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Lead-free solder
Mechanical behaviour
Metal matrix nanocomposites
Microwave sintering
Online Access:http://scholarbank.nus.edu.sg/handle/10635/60571
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Institution: National University of Singapore
Description
Summary:10.1179/174328408X378582

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