Integrating copper at the nanometer length scale with Sn-3·5Ag solder to develop high performance nanocomposites

10.1179/174328408X378582

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Bibliographic Details
Main Authors:	Babaghorbani, P., Nai, S.M.L., Gupta, M.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Lead-free solder Mechanical behaviour Metal matrix nanocomposites Microwave sintering
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/60571
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-60571
record_format	dspace
spelling	sg-nus-scholar.10635-605712023-10-31T07:20:12Z Integrating copper at the nanometer length scale with Sn-3·5Ag solder to develop high performance nanocomposites Babaghorbani, P. Nai, S.M.L. Gupta, M. MECHANICAL ENGINEERING Lead-free solder Mechanical behaviour Metal matrix nanocomposites Microwave sintering 10.1179/174328408X378582 Materials Science and Technology 25 10 1258-1264 MSCTE 2014-06-17T06:24:49Z 2014-06-17T06:24:49Z 2009 Article Babaghorbani, P., Nai, S.M.L., Gupta, M. (2009). Integrating copper at the nanometer length scale with Sn-3·5Ag solder to develop high performance nanocomposites. Materials Science and Technology 25 (10) : 1258-1264. ScholarBank@NUS Repository. https://doi.org/10.1179/174328408X378582 02670836 http://scholarbank.nus.edu.sg/handle/10635/60571 000270645300014 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Lead-free solder Mechanical behaviour Metal matrix nanocomposites Microwave sintering
spellingShingle	Lead-free solder Mechanical behaviour Metal matrix nanocomposites Microwave sintering Babaghorbani, P. Nai, S.M.L. Gupta, M. Integrating copper at the nanometer length scale with Sn-3·5Ag solder to develop high performance nanocomposites
description	10.1179/174328408X378582
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Babaghorbani, P. Nai, S.M.L. Gupta, M.
format	Article
author	Babaghorbani, P. Nai, S.M.L. Gupta, M.
author_sort	Babaghorbani, P.
title	Integrating copper at the nanometer length scale with Sn-3·5Ag solder to develop high performance nanocomposites
title_short	Integrating copper at the nanometer length scale with Sn-3·5Ag solder to develop high performance nanocomposites
title_full	Integrating copper at the nanometer length scale with Sn-3·5Ag solder to develop high performance nanocomposites
title_fullStr	Integrating copper at the nanometer length scale with Sn-3·5Ag solder to develop high performance nanocomposites
title_full_unstemmed	Integrating copper at the nanometer length scale with Sn-3·5Ag solder to develop high performance nanocomposites
title_sort	integrating copper at the nanometer length scale with sn-3·5ag solder to develop high performance nanocomposites
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/60571
_version_	1781781871370174464

Integrating copper at the nanometer length scale with Sn-3·5Ag solder to develop high performance nanocomposites

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