Interface delamination in plastic IC packages induced by thermal loading and vapor pressure - A micromechanics model

Interface delamination in plastic IC packages induced by thermal loading and vapor pressure - A micromechanics model

10.1109/TADVP.2003.811370

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Bibliographic Details
Main Authors: Liu, P., Cheng, L., Zhang, Y.-W.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Cohesive law
Finite element method
Interface delamination
Mode mixity
Plastic IC packages
Thermal loading
Vapor pressure
Online Access:http://scholarbank.nus.edu.sg/handle/10635/60586
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Institution: National University of Singapore
Description
Summary:10.1109/TADVP.2003.811370

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