Interface delamination in plastic IC packages induced by thermal loading and vapor pressure - A micromechanics model
10.1109/TADVP.2003.811370
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| Main Authors: | , , |
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| Other Authors: | |
| Format: | Article |
| Published: |
2014
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| Subjects: | |
| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/60586 |
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| Institution: | National University of Singapore |