Interface delamination in plastic IC packages induced by thermal loading and vapor pressure - A micromechanics model

Interface delamination in plastic IC packages induced by thermal loading and vapor pressure - A micromechanics model

10.1109/TADVP.2003.811370

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Bibliographic Details
Main Authors: Liu, P., Cheng, L., Zhang, Y.-W.
Other Authors: MATERIALS SCIENCE
Format: Article
Published: 2014
Subjects:
Cohesive law
Finite element method
Interface delamination
Mode mixity
Plastic IC packages
Thermal loading
Vapor pressure
Online Access:http://scholarbank.nus.edu.sg/handle/10635/60586
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Institution: National University of Singapore
id sg-nus-scholar.10635-60586
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spelling sg-nus-scholar.10635-605862024-11-11T04:52:10Z Interface delamination in plastic IC packages induced by thermal loading and vapor pressure - A micromechanics model Liu, P. Cheng, L. Zhang, Y.-W. MATERIALS SCIENCE MECHANICAL ENGINEERING Cohesive law Finite element method Interface delamination Mode mixity Plastic IC packages Thermal loading Vapor pressure 10.1109/TADVP.2003.811370 IEEE Transactions on Advanced Packaging 26 1 1-9 ITAPF 2014-06-17T06:25:00Z 2014-06-17T06:25:00Z 2003-02 Article Liu, P., Cheng, L., Zhang, Y.-W. (2003-02). Interface delamination in plastic IC packages induced by thermal loading and vapor pressure - A micromechanics model. IEEE Transactions on Advanced Packaging 26 (1) : 1-9. ScholarBank@NUS Repository. https://doi.org/10.1109/TADVP.2003.811370 15213323 http://scholarbank.nus.edu.sg/handle/10635/60586 000182870300001 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Cohesive law
Finite element method
Interface delamination
Mode mixity
Plastic IC packages
Thermal loading
Vapor pressure
spellingShingle Cohesive law
Finite element method
Interface delamination
Mode mixity
Plastic IC packages
Thermal loading
Vapor pressure
Liu, P.
Cheng, L.
Zhang, Y.-W.
Interface delamination in plastic IC packages induced by thermal loading and vapor pressure - A micromechanics model
description 10.1109/TADVP.2003.811370
author2 MATERIALS SCIENCE
author_facet MATERIALS SCIENCE
Liu, P.
Cheng, L.
Zhang, Y.-W.
format Article
author Liu, P.
Cheng, L.
Zhang, Y.-W.
author_sort Liu, P.
title Interface delamination in plastic IC packages induced by thermal loading and vapor pressure - A micromechanics model
title_short Interface delamination in plastic IC packages induced by thermal loading and vapor pressure - A micromechanics model
title_full Interface delamination in plastic IC packages induced by thermal loading and vapor pressure - A micromechanics model
title_fullStr Interface delamination in plastic IC packages induced by thermal loading and vapor pressure - A micromechanics model
title_full_unstemmed Interface delamination in plastic IC packages induced by thermal loading and vapor pressure - A micromechanics model
title_sort interface delamination in plastic ic packages induced by thermal loading and vapor pressure - a micromechanics model
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/60586
_version_ 1821204985128419328

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