Interface delamination in plastic IC packages induced by thermal loading and vapor pressure - A micromechanics model

• Main Authors: Liu, P., Cheng, L., Zhang, Y.-W.
• 其他作者: MATERIALS SCIENCE
• 格式: Article
• 出版: 2014
• 主題: Cohesive law; Finite element method; Interface delamination; Mode mixity; Plastic IC packages; Thermal loading; Vapor pressure
• 在線閱讀: http://scholarbank.nus.edu.sg/handle/10635/60586

10.1109/TADVP.2003.811370