Mapping the failure envelope of board-level solder joints

Mapping the failure envelope of board-level solder joints

10.1016/j.microrel.2008.12.013

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Bibliographic Details
Main Authors: Tan, L.B., Zhang, X., Lim, C.T., Tan, V.B.C.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/60674
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Institution: National University of Singapore
Description
Summary:10.1016/j.microrel.2008.12.013

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