Mapping the failure envelope of board-level solder joints

10.1016/j.microrel.2008.12.013

Saved in:

Bibliographic Details
Main Authors:	Tan, L.B., Zhang, X., Lim, C.T., Tan, V.B.C.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/60674
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

id	sg-nus-scholar.10635-60674
record_format	dspace
spelling	sg-nus-scholar.10635-606742023-10-30T22:07:02Z Mapping the failure envelope of board-level solder joints Tan, L.B. Zhang, X. Lim, C.T. Tan, V.B.C. MECHANICAL ENGINEERING 10.1016/j.microrel.2008.12.013 Microelectronics Reliability 49 4 397-409 MCRLA 2014-06-17T06:26:00Z 2014-06-17T06:26:00Z 2009-04 Article Tan, L.B., Zhang, X., Lim, C.T., Tan, V.B.C. (2009-04). Mapping the failure envelope of board-level solder joints. Microelectronics Reliability 49 (4) : 397-409. ScholarBank@NUS Repository. https://doi.org/10.1016/j.microrel.2008.12.013 00262714 http://scholarbank.nus.edu.sg/handle/10635/60674 000265870100008 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1016/j.microrel.2008.12.013
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Tan, L.B. Zhang, X. Lim, C.T. Tan, V.B.C.
format	Article
author	Tan, L.B. Zhang, X. Lim, C.T. Tan, V.B.C.
spellingShingle	Tan, L.B. Zhang, X. Lim, C.T. Tan, V.B.C. Mapping the failure envelope of board-level solder joints
author_sort	Tan, L.B.
title	Mapping the failure envelope of board-level solder joints
title_short	Mapping the failure envelope of board-level solder joints
title_full	Mapping the failure envelope of board-level solder joints
title_fullStr	Mapping the failure envelope of board-level solder joints
title_full_unstemmed	Mapping the failure envelope of board-level solder joints
title_sort	mapping the failure envelope of board-level solder joints
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/60674
_version_	1781781892940431360

Mapping the failure envelope of board-level solder joints

Similar Items