Mapping the failure envelope of board-level solder joints

10.1016/j.microrel.2008.12.013

Saved in:
Bibliographic Details
Main Authors: Tan, L.B., Zhang, X., Lim, C.T., Tan, V.B.C.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/60674
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore

Similar Items