Modeling of interfacial delamination in plastic IC packages under hygrothermal loading

10.1115/1.1938209

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Bibliographic Details
Main Author:	Tay, A.A.O.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/60795
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-60795
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spelling	sg-nus-scholar.10635-607952023-10-26T08:41:04Z Modeling of interfacial delamination in plastic IC packages under hygrothermal loading Tay, A.A.O. MECHANICAL ENGINEERING 10.1115/1.1938209 Journal of Electronic Packaging, Transactions of the ASME 127 3 268-275 JEPAE 2014-06-17T06:27:25Z 2014-06-17T06:27:25Z 2005-09 Article Tay, A.A.O. (2005-09). Modeling of interfacial delamination in plastic IC packages under hygrothermal loading. Journal of Electronic Packaging, Transactions of the ASME 127 (3) : 268-275. ScholarBank@NUS Repository. https://doi.org/10.1115/1.1938209 10437398 http://scholarbank.nus.edu.sg/handle/10635/60795 000232438500010 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1115/1.1938209
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Tay, A.A.O.
format	Article
author	Tay, A.A.O.
spellingShingle	Tay, A.A.O. Modeling of interfacial delamination in plastic IC packages under hygrothermal loading
author_sort	Tay, A.A.O.
title	Modeling of interfacial delamination in plastic IC packages under hygrothermal loading
title_short	Modeling of interfacial delamination in plastic IC packages under hygrothermal loading
title_full	Modeling of interfacial delamination in plastic IC packages under hygrothermal loading
title_fullStr	Modeling of interfacial delamination in plastic IC packages under hygrothermal loading
title_full_unstemmed	Modeling of interfacial delamination in plastic IC packages under hygrothermal loading
title_sort	modeling of interfacial delamination in plastic ic packages under hygrothermal loading
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/60795
_version_	1781781916445310976

Modeling of interfacial delamination in plastic IC packages under hygrothermal loading

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