Modeling of interfacial delamination in plastic IC packages under hygrothermal loading
10.1115/1.1938209
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Main Author: | Tay, A.A.O. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Article |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/60795 |
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Institution: | National University of Singapore |
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