Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer

Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer

10.1016/j.wear.2004.12.020

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Bibliographic Details
Main Authors: Li, X.P., He, T., Rahman, M.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Ductile mode cutting
Nanoscale
Silicon wafer
Tool wear
Online Access:http://scholarbank.nus.edu.sg/handle/10635/61590
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Institution: National University of Singapore
Description
Summary:10.1016/j.wear.2004.12.020

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