Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer

Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer

10.1016/j.wear.2004.12.020

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Bibliographic Details
Main Authors: Li, X.P., He, T., Rahman, M.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Ductile mode cutting
Nanoscale
Silicon wafer
Tool wear
Online Access:http://scholarbank.nus.edu.sg/handle/10635/61590
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Institution: National University of Singapore
id sg-nus-scholar.10635-61590
record_format dspace
spelling sg-nus-scholar.10635-615902023-10-26T20:52:29Z Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer Li, X.P. He, T. Rahman, M. MECHANICAL ENGINEERING Ductile mode cutting Nanoscale Silicon wafer Tool wear 10.1016/j.wear.2004.12.020 Wear 259 7-12 1207-1214 WEARA 2014-06-17T06:36:57Z 2014-06-17T06:36:57Z 2005-08 Article Li, X.P., He, T., Rahman, M. (2005-08). Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer. Wear 259 (7-12) : 1207-1214. ScholarBank@NUS Repository. https://doi.org/10.1016/j.wear.2004.12.020 00431648 http://scholarbank.nus.edu.sg/handle/10635/61590 000230370300052 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Ductile mode cutting
Nanoscale
Silicon wafer
Tool wear
spellingShingle Ductile mode cutting
Nanoscale
Silicon wafer
Tool wear
Li, X.P.
He, T.
Rahman, M.
Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer
description 10.1016/j.wear.2004.12.020
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Li, X.P.
He, T.
Rahman, M.
format Article
author Li, X.P.
He, T.
Rahman, M.
author_sort Li, X.P.
title Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer
title_short Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer
title_full Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer
title_fullStr Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer
title_full_unstemmed Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer
title_sort tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/61590
_version_ 1781782081262583808

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