Wear phenomena in abrasive-free copper CMP process

10.1149/1.2051954

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Bibliographic Details
Main Authors:	Balakumar, S., Haque, T., Kumar, A.S., Rahman, M., Kumar, R.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/61696
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-61696
record_format	dspace
spelling	sg-nus-scholar.10635-616962023-10-25T21:31:16Z Wear phenomena in abrasive-free copper CMP process Balakumar, S. Haque, T. Kumar, A.S. Rahman, M. Kumar, R. MECHANICAL ENGINEERING 10.1149/1.2051954 Journal of the Electrochemical Society 152 11 G867-G874 JESOA 2014-06-17T06:38:14Z 2014-06-17T06:38:14Z 2005 Article Balakumar, S., Haque, T., Kumar, A.S., Rahman, M., Kumar, R. (2005). Wear phenomena in abrasive-free copper CMP process. Journal of the Electrochemical Society 152 (11) : G867-G874. ScholarBank@NUS Repository. https://doi.org/10.1149/1.2051954 00134651 http://scholarbank.nus.edu.sg/handle/10635/61696 000233133700069 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1149/1.2051954
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Balakumar, S. Haque, T. Kumar, A.S. Rahman, M. Kumar, R.
format	Article
author	Balakumar, S. Haque, T. Kumar, A.S. Rahman, M. Kumar, R.
spellingShingle	Balakumar, S. Haque, T. Kumar, A.S. Rahman, M. Kumar, R. Wear phenomena in abrasive-free copper CMP process
author_sort	Balakumar, S.
title	Wear phenomena in abrasive-free copper CMP process
title_short	Wear phenomena in abrasive-free copper CMP process
title_full	Wear phenomena in abrasive-free copper CMP process
title_fullStr	Wear phenomena in abrasive-free copper CMP process
title_full_unstemmed	Wear phenomena in abrasive-free copper CMP process
title_sort	wear phenomena in abrasive-free copper cmp process
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/61696
_version_	1781782102979641344

Wear phenomena in abrasive-free copper CMP process

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