Wear phenomena in abrasive-free copper CMP process
10.1149/1.2051954
Saved in:
Main Authors: | Balakumar, S., Haque, T., Kumar, A.S., Rahman, M., Kumar, R. |
---|---|
Other Authors: | MECHANICAL ENGINEERING |
Format: | Article |
Published: |
2014
|
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/61696 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
A material removal rate model for copper abrasive-free CMP
by: Haque, T., et al.
Published: (2014) -
Investigation on abrasive free Copper chemical mechanical planarization for Cu/low k and Cu/ultra low k interconnects
by: Balakumar, S., et al.
Published: (2014) -
Modeling and characterization of abrasive-free copper chemical mechanical planarization process
by: TABASSUMUL HAQUE
Published: (2010) -
Scratching of polymers-Modeling abrasive wear
by: Sinha, S.K., et al.
Published: (2014) -
Design of an abrasive wear test module
by: Heng, Ryan Wei Quan.
Published: (2013)