Wear phenomena in abrasive-free copper CMP process

10.1149/1.2051954

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Bibliographic Details
Main Authors:	Balakumar, S., Haque, T., Kumar, A.S., Rahman, M., Kumar, R.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/61696
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Institution:	National University of Singapore

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