Yield improvement for anodic bonding with suspending structure
10.1016/j.sna.2007.11.009
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sg-nus-scholar.10635-617052023-08-28T20:59:08Z Yield improvement for anodic bonding with suspending structure Yu, H. Zhou, G. Chau, F.S. MECHANICAL ENGINEERING Anodic bonding MEMS Snap-down Suspending structure 10.1016/j.sna.2007.11.009 Sensors and Actuators, A: Physical 143 2 462-468 SAAPE 2014-06-17T06:38:20Z 2014-06-17T06:38:20Z 2008-05-16 Article Yu, H., Zhou, G., Chau, F.S. (2008-05-16). Yield improvement for anodic bonding with suspending structure. Sensors and Actuators, A: Physical 143 (2) : 462-468. ScholarBank@NUS Repository. https://doi.org/10.1016/j.sna.2007.11.009 09244247 http://scholarbank.nus.edu.sg/handle/10635/61705 000255453400036 Scopus |
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Anodic bonding MEMS Snap-down Suspending structure |
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Anodic bonding MEMS Snap-down Suspending structure Yu, H. Zhou, G. Chau, F.S. Yield improvement for anodic bonding with suspending structure |
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10.1016/j.sna.2007.11.009 |
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MECHANICAL ENGINEERING |
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MECHANICAL ENGINEERING Yu, H. Zhou, G. Chau, F.S. |
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Article |
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Yu, H. Zhou, G. Chau, F.S. |
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Yu, H. |
title |
Yield improvement for anodic bonding with suspending structure |
title_short |
Yield improvement for anodic bonding with suspending structure |
title_full |
Yield improvement for anodic bonding with suspending structure |
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Yield improvement for anodic bonding with suspending structure |
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Yield improvement for anodic bonding with suspending structure |
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yield improvement for anodic bonding with suspending structure |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/61705 |
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