Yield improvement for anodic bonding with suspending structure

Yield improvement for anodic bonding with suspending structure

10.1016/j.sna.2007.11.009

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Bibliographic Details
Main Authors: Yu, H., Zhou, G., Chau, F.S.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Anodic bonding
MEMS
Snap-down
Suspending structure
Online Access:http://scholarbank.nus.edu.sg/handle/10635/61705
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/61705

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