Characterization of interconnect defects using scanning thermal conductivity microscopy

Proceedings of the 30th International Symposium for Testing and Failure Analysis, ISTFA 2004

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Main Authors:	Ho, H.W., Phang, J.C.H., Altes, A., Balk, L.J.
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/69587
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-69587
record_format	dspace
spelling	sg-nus-scholar.10635-695872024-11-13T12:53:50Z Characterization of interconnect defects using scanning thermal conductivity microscopy Ho, H.W. Phang, J.C.H. Altes, A. Balk, L.J. ELECTRICAL & COMPUTER ENGINEERING Proceedings of the 30th International Symposium for Testing and Failure Analysis, ISTFA 2004 363-368 2014-06-19T03:02:22Z 2014-06-19T03:02:22Z 2004 Conference Paper Ho, H.W.,Phang, J.C.H.,Altes, A.,Balk, L.J. (2004). Characterization of interconnect defects using scanning thermal conductivity microscopy. Proceedings of the 30th International Symposium for Testing and Failure Analysis, ISTFA 2004 : 363-368. ScholarBank@NUS Repository. 0871708078 http://scholarbank.nus.edu.sg/handle/10635/69587 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	Proceedings of the 30th International Symposium for Testing and Failure Analysis, ISTFA 2004
author2	ELECTRICAL & COMPUTER ENGINEERING
author_facet	ELECTRICAL & COMPUTER ENGINEERING Ho, H.W. Phang, J.C.H. Altes, A. Balk, L.J.
format	Conference or Workshop Item
author	Ho, H.W. Phang, J.C.H. Altes, A. Balk, L.J.
spellingShingle	Ho, H.W. Phang, J.C.H. Altes, A. Balk, L.J. Characterization of interconnect defects using scanning thermal conductivity microscopy
author_sort	Ho, H.W.
title	Characterization of interconnect defects using scanning thermal conductivity microscopy
title_short	Characterization of interconnect defects using scanning thermal conductivity microscopy
title_full	Characterization of interconnect defects using scanning thermal conductivity microscopy
title_fullStr	Characterization of interconnect defects using scanning thermal conductivity microscopy
title_full_unstemmed	Characterization of interconnect defects using scanning thermal conductivity microscopy
title_sort	characterization of interconnect defects using scanning thermal conductivity microscopy
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/69587
_version_	1821182529108967424

Characterization of interconnect defects using scanning thermal conductivity microscopy

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