Electrical characterization of through-silicon vias (TSV) with different physical configurations

Electrical characterization of through-silicon vias (TSV) with different physical configurations

10.1109/EDAPS.2012.6469384

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Bibliographic Details
Main Authors: Zhao, W.-S., Guo, Y.-X., Yin, W.-Y.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/70125
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Institution: National University of Singapore
Description
Summary:10.1109/EDAPS.2012.6469384

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