Electrical characterization of through-silicon vias (TSV) with different physical configurations

• Main Authors: Zhao, W.-S., Guo, Y.-X., Yin, W.-Y.
• Other Authors: ELECTRICAL & COMPUTER ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/70125
• Institution: National University of Singapore

10.1109/EDAPS.2012.6469384