Electrical characterization of through-silicon vias (TSV) with different physical configurations
10.1109/EDAPS.2012.6469384
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2014
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sg-nus-scholar.10635-701252015-01-25T01:36:26Z Electrical characterization of through-silicon vias (TSV) with different physical configurations Zhao, W.-S. Guo, Y.-X. Yin, W.-Y. ELECTRICAL & COMPUTER ENGINEERING 10.1109/EDAPS.2012.6469384 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2012 173-176 2014-06-19T03:08:33Z 2014-06-19T03:08:33Z 2012 Conference Paper Zhao, W.-S.,Guo, Y.-X.,Yin, W.-Y. (2012). Electrical characterization of through-silicon vias (TSV) with different physical configurations. 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2012 : 173-176. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/EDAPS.2012.6469384" target="_blank">https://doi.org/10.1109/EDAPS.2012.6469384</a> 9781467314435 http://scholarbank.nus.edu.sg/handle/10635/70125 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
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ScholarBank@NUS |
| description |
10.1109/EDAPS.2012.6469384 |
| author2 |
ELECTRICAL & COMPUTER ENGINEERING |
| author_facet |
ELECTRICAL & COMPUTER ENGINEERING Zhao, W.-S. Guo, Y.-X. Yin, W.-Y. |
| format |
Conference or Workshop Item |
| author |
Zhao, W.-S. Guo, Y.-X. Yin, W.-Y. |
| spellingShingle |
Zhao, W.-S. Guo, Y.-X. Yin, W.-Y. Electrical characterization of through-silicon vias (TSV) with different physical configurations |
| author_sort |
Zhao, W.-S. |
| title |
Electrical characterization of through-silicon vias (TSV) with different physical configurations |
| title_short |
Electrical characterization of through-silicon vias (TSV) with different physical configurations |
| title_full |
Electrical characterization of through-silicon vias (TSV) with different physical configurations |
| title_fullStr |
Electrical characterization of through-silicon vias (TSV) with different physical configurations |
| title_full_unstemmed |
Electrical characterization of through-silicon vias (TSV) with different physical configurations |
| title_sort |
electrical characterization of through-silicon vias (tsv) with different physical configurations |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/70125 |
| _version_ |
1681087141339201536 |