Experimental characterization of the reliability of 3-terminal dual-damascene copper interconnect trees

Experimental characterization of the reliability of 3-terminal dual-damascene copper interconnect trees

Materials Research Society Symposium - Proceedings

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Bibliographic Details
Main Authors: Gan, C.L., Thompson, C.V., Pey, K.L., Choi, W.K., Wei, F., Yu, B., Hau-Riege, S.P.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/70243
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/70243

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