Length effects on the reliability of dual-damascene Cu interconnects

Length effects on the reliability of dual-damascene Cu interconnects

Materials Research Society Symposium - Proceedings

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Bibliographic Details
Main Authors: Wei, F., Gan, C.L., Thompson, C.V., Clement, J.J., Hau-Riege, S.P., Pey, K.L., Choi, W.K., Tay, H.L., Yu, B., Radhakrishnan, M.K.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/70791
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/70791

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