Length effects on the reliability of dual-damascene Cu interconnects

Length effects on the reliability of dual-damascene Cu interconnects

Materials Research Society Symposium - Proceedings

Saved in:
Bibliographic Details
Main Authors: Wei, F., Gan, C.L., Thompson, C.V., Clement, J.J., Hau-Riege, S.P., Pey, K.L., Choi, W.K., Tay, H.L., Yu, B., Radhakrishnan, M.K.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/70791
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
id sg-nus-scholar.10635-70791
record_format dspace
spelling sg-nus-scholar.10635-707912015-01-16T10:07:19Z Length effects on the reliability of dual-damascene Cu interconnects Wei, F. Gan, C.L. Thompson, C.V. Clement, J.J. Hau-Riege, S.P. Pey, K.L. Choi, W.K. Tay, H.L. Yu, B. Radhakrishnan, M.K. ELECTRICAL & COMPUTER ENGINEERING Materials Research Society Symposium - Proceedings 716 645-650 MRSPD 2014-06-19T03:16:16Z 2014-06-19T03:16:16Z 2002 Conference Paper Wei, F.,Gan, C.L.,Thompson, C.V.,Clement, J.J.,Hau-Riege, S.P.,Pey, K.L.,Choi, W.K.,Tay, H.L.,Yu, B.,Radhakrishnan, M.K. (2002). Length effects on the reliability of dual-damascene Cu interconnects. Materials Research Society Symposium - Proceedings 716 : 645-650. ScholarBank@NUS Repository. 02729172 http://scholarbank.nus.edu.sg/handle/10635/70791 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description Materials Research Society Symposium - Proceedings
author2 ELECTRICAL & COMPUTER ENGINEERING
author_facet ELECTRICAL & COMPUTER ENGINEERING
Wei, F.
Gan, C.L.
Thompson, C.V.
Clement, J.J.
Hau-Riege, S.P.
Pey, K.L.
Choi, W.K.
Tay, H.L.
Yu, B.
Radhakrishnan, M.K.
format Conference or Workshop Item
author Wei, F.
Gan, C.L.
Thompson, C.V.
Clement, J.J.
Hau-Riege, S.P.
Pey, K.L.
Choi, W.K.
Tay, H.L.
Yu, B.
Radhakrishnan, M.K.
spellingShingle Wei, F.
Gan, C.L.
Thompson, C.V.
Clement, J.J.
Hau-Riege, S.P.
Pey, K.L.
Choi, W.K.
Tay, H.L.
Yu, B.
Radhakrishnan, M.K.
Length effects on the reliability of dual-damascene Cu interconnects
author_sort Wei, F.
title Length effects on the reliability of dual-damascene Cu interconnects
title_short Length effects on the reliability of dual-damascene Cu interconnects
title_full Length effects on the reliability of dual-damascene Cu interconnects
title_fullStr Length effects on the reliability of dual-damascene Cu interconnects
title_full_unstemmed Length effects on the reliability of dual-damascene Cu interconnects
title_sort length effects on the reliability of dual-damascene cu interconnects
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/70791
_version_ 1681087265123598336

Similar Items