Length effects on the reliability of dual-damascene Cu interconnects

• Main Authors: Wei, F., Gan, C.L., Thompson, C.V., Clement, J.J., Hau-Riege, S.P., Pey, K.L., Choi, W.K., Tay, H.L., Yu, B., Radhakrishnan, M.K.
• Other Authors: ELECTRICAL & COMPUTER ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/70791
• Institution: National University of Singapore

Materials Research Society Symposium - Proceedings