Length effects on the reliability of dual-damascene Cu interconnects
Materials Research Society Symposium - Proceedings
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Main Authors: | Wei, F., Gan, C.L., Thompson, C.V., Clement, J.J., Hau-Riege, S.P., Pey, K.L., Choi, W.K., Tay, H.L., Yu, B., Radhakrishnan, M.K. |
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Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/70791 |
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Institution: | National University of Singapore |
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