Multi-via electromigration test structures for identification and characterization of different failure mechanisms

Multi-via electromigration test structures for identification and characterization of different failure mechanisms

Materials Research Society Symposium Proceedings

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Bibliographic Details
Main Authors: Choi, Z.-S., Chang, C.W., Lee, J.H., Gan, C.L., Thompson, C.V., Pey, K.L., Choi, W.K.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/83994
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/83994

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