Multi-via electromigration test structures for identification and characterization of different failure mechanisms

Materials Research Society Symposium Proceedings

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Main Authors:	Choi, Z.-S., Chang, C.W., Lee, J.H., Gan, C.L., Thompson, C.V., Pey, K.L., Choi, W.K.
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/83994
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-83994
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spelling	sg-nus-scholar.10635-839942024-11-09T00:15:30Z Multi-via electromigration test structures for identification and characterization of different failure mechanisms Choi, Z.-S. Chang, C.W. Lee, J.H. Gan, C.L. Thompson, C.V. Pey, K.L. Choi, W.K. ELECTRICAL & COMPUTER ENGINEERING Materials Research Society Symposium Proceedings 863 271-276 MRSPD 2014-10-07T04:47:34Z 2014-10-07T04:47:34Z 2005 Conference Paper Choi, Z.-S.,Chang, C.W.,Lee, J.H.,Gan, C.L.,Thompson, C.V.,Pey, K.L.,Choi, W.K. (2005). Multi-via electromigration test structures for identification and characterization of different failure mechanisms. Materials Research Society Symposium Proceedings 863 : 271-276. ScholarBank@NUS Repository. 02729172 http://scholarbank.nus.edu.sg/handle/10635/83994 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	Materials Research Society Symposium Proceedings
author2	ELECTRICAL & COMPUTER ENGINEERING
author_facet	ELECTRICAL & COMPUTER ENGINEERING Choi, Z.-S. Chang, C.W. Lee, J.H. Gan, C.L. Thompson, C.V. Pey, K.L. Choi, W.K.
format	Conference or Workshop Item
author	Choi, Z.-S. Chang, C.W. Lee, J.H. Gan, C.L. Thompson, C.V. Pey, K.L. Choi, W.K.
spellingShingle	Choi, Z.-S. Chang, C.W. Lee, J.H. Gan, C.L. Thompson, C.V. Pey, K.L. Choi, W.K. Multi-via electromigration test structures for identification and characterization of different failure mechanisms
author_sort	Choi, Z.-S.
title	Multi-via electromigration test structures for identification and characterization of different failure mechanisms
title_short	Multi-via electromigration test structures for identification and characterization of different failure mechanisms
title_full	Multi-via electromigration test structures for identification and characterization of different failure mechanisms
title_fullStr	Multi-via electromigration test structures for identification and characterization of different failure mechanisms
title_full_unstemmed	Multi-via electromigration test structures for identification and characterization of different failure mechanisms
title_sort	multi-via electromigration test structures for identification and characterization of different failure mechanisms
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/83994
_version_	1821184587151179776

Multi-via electromigration test structures for identification and characterization of different failure mechanisms

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