Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance

• Main Authors: Ong, J.M.G., Tay, A.A.O., Zhang, X., Kripesh, V., Lim, Y.K., Tan, J.B., Sohn, D.K.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/73729
• Institution: National University of Singapore

10.1109/ECTC.2008.4550103