Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance

Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance

10.1109/ECTC.2008.4550103

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Bibliographic Details
Main Authors: Ong, J.M.G., Tay, A.A.O., Zhang, X., Kripesh, V., Lim, Y.K., Tan, J.B., Sohn, D.K.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73729
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Institution: National University of Singapore
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Summary:10.1109/ECTC.2008.4550103

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