Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance
10.1109/ECTC.2008.4550103
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2014
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sg-nus-scholar.10635-737292023-10-30T20:23:36Z Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance Ong, J.M.G. Tay, A.A.O. Zhang, X. Kripesh, V. Lim, Y.K. Tan, J.B. Sohn, D.K. MECHANICAL ENGINEERING 10.1109/ECTC.2008.4550103 Proceedings - Electronic Components and Technology Conference 1031-1035 PECCA 2014-06-19T05:38:40Z 2014-06-19T05:38:40Z 2008 Conference Paper Ong, J.M.G., Tay, A.A.O., Zhang, X., Kripesh, V., Lim, Y.K., Tan, J.B., Sohn, D.K. (2008). Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance. Proceedings - Electronic Components and Technology Conference : 1031-1035. ScholarBank@NUS Repository. https://doi.org/10.1109/ECTC.2008.4550103 9781424422302 05695503 http://scholarbank.nus.edu.sg/handle/10635/73729 000257141200163 Scopus |
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10.1109/ECTC.2008.4550103 |
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MECHANICAL ENGINEERING |
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MECHANICAL ENGINEERING Ong, J.M.G. Tay, A.A.O. Zhang, X. Kripesh, V. Lim, Y.K. Tan, J.B. Sohn, D.K. |
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Conference or Workshop Item |
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Ong, J.M.G. Tay, A.A.O. Zhang, X. Kripesh, V. Lim, Y.K. Tan, J.B. Sohn, D.K. |
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Ong, J.M.G. Tay, A.A.O. Zhang, X. Kripesh, V. Lim, Y.K. Tan, J.B. Sohn, D.K. Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance |
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Ong, J.M.G. |
title |
Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance |
title_short |
Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance |
title_full |
Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance |
title_fullStr |
Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance |
title_full_unstemmed |
Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance |
title_sort |
optimization of reliability of copper-low-k flip chip package with variable interconnect compliance |
publishDate |
2014 |
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http://scholarbank.nus.edu.sg/handle/10635/73729 |
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1781783330905128960 |