Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance

10.1109/ECTC.2008.4550103

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Bibliographic Details
Main Authors:	Ong, J.M.G., Tay, A.A.O., Zhang, X., Kripesh, V., Lim, Y.K., Tan, J.B., Sohn, D.K.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73729
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-73729
record_format	dspace
spelling	sg-nus-scholar.10635-737292023-10-30T20:23:36Z Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance Ong, J.M.G. Tay, A.A.O. Zhang, X. Kripesh, V. Lim, Y.K. Tan, J.B. Sohn, D.K. MECHANICAL ENGINEERING 10.1109/ECTC.2008.4550103 Proceedings - Electronic Components and Technology Conference 1031-1035 PECCA 2014-06-19T05:38:40Z 2014-06-19T05:38:40Z 2008 Conference Paper Ong, J.M.G., Tay, A.A.O., Zhang, X., Kripesh, V., Lim, Y.K., Tan, J.B., Sohn, D.K. (2008). Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance. Proceedings - Electronic Components and Technology Conference : 1031-1035. ScholarBank@NUS Repository. https://doi.org/10.1109/ECTC.2008.4550103 9781424422302 05695503 http://scholarbank.nus.edu.sg/handle/10635/73729 000257141200163 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1109/ECTC.2008.4550103
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Ong, J.M.G. Tay, A.A.O. Zhang, X. Kripesh, V. Lim, Y.K. Tan, J.B. Sohn, D.K.
format	Conference or Workshop Item
author	Ong, J.M.G. Tay, A.A.O. Zhang, X. Kripesh, V. Lim, Y.K. Tan, J.B. Sohn, D.K.
spellingShingle	Ong, J.M.G. Tay, A.A.O. Zhang, X. Kripesh, V. Lim, Y.K. Tan, J.B. Sohn, D.K. Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance
author_sort	Ong, J.M.G.
title	Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance
title_short	Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance
title_full	Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance
title_fullStr	Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance
title_full_unstemmed	Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance
title_sort	optimization of reliability of copper-low-k flip chip package with variable interconnect compliance
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73729
_version_	1781783330905128960

Optimization of reliability of copper-low-k flip chip package with variable interconnect compliance

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