High aspect pattern formation by integration of micro inkjetting and electroless plating

High aspect pattern formation by integration of micro inkjetting and electroless plating

10.1109/DTIP.2008.4752975

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Bibliographic Details
Main Authors: Gian, P.W., Shan, X., Liang, Y.N., Lok, B.K., Lu, C.W., Ooi, B.L.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/70466
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/70466

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