High aspect pattern formation by integration of micro inkjetting and electroless plating

• Main Authors: Gian, P.W., Shan, X., Liang, Y.N., Lok, B.K., Lu, C.W., Ooi, B.L.
• Other Authors: ELECTRICAL & COMPUTER ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/70466
• Institution: National University of Singapore

10.1109/DTIP.2008.4752975