High aspect pattern formation by integration of micro inkjetting and electroless plating
10.1109/DTIP.2008.4752975
Saved in:
Main Authors: | Gian, P.W., Shan, X., Liang, Y.N., Lok, B.K., Lu, C.W., Ooi, B.L. |
---|---|
Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
|
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/70466 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
Comparison between electroplating and electroless plating method with inkjet printing for conductive line patterning
by: Wanida Tunyong
Published: (2013) -
Micro-grooving on electroless nickel plated die materials
by: ALTABUL QUDDUS BIDDUT
Published: (2010) -
Ultra-precision machining of micro grooves on electroless nickel plated material
by: KHANDAKER MOSTAFA REZAUR RAHMAN
Published: (2010) -
Patterned surface with controllable wettability for inkjet printing of flexible printed electronics
by: Nguyen, Phuong Q. M, et al.
Published: (2014) -
Characterization of alumina and spinel ceramic based inks for experimental investigation of inkjet printing for micro pattern generation on micro components
by: Yeo, Melvin Kiong Wei.
Published: (2009)