High aspect pattern formation by integration of micro inkjetting and electroless plating
10.1109/DTIP.2008.4752975
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sg-nus-scholar.10635-704662023-10-26T21:07:48Z High aspect pattern formation by integration of micro inkjetting and electroless plating Gian, P.W. Shan, X. Liang, Y.N. Lok, B.K. Lu, C.W. Ooi, B.L. ELECTRICAL & COMPUTER ENGINEERING 10.1109/DTIP.2008.4752975 DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 162-167 2014-06-19T03:12:28Z 2014-06-19T03:12:28Z 2008 Conference Paper Gian, P.W., Shan, X., Liang, Y.N., Lok, B.K., Lu, C.W., Ooi, B.L. (2008). High aspect pattern formation by integration of micro inkjetting and electroless plating. DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS : 162-167. ScholarBank@NUS Repository. https://doi.org/10.1109/DTIP.2008.4752975 9782355000065 http://scholarbank.nus.edu.sg/handle/10635/70466 000264735500036 Scopus |
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10.1109/DTIP.2008.4752975 |
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ELECTRICAL & COMPUTER ENGINEERING |
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ELECTRICAL & COMPUTER ENGINEERING Gian, P.W. Shan, X. Liang, Y.N. Lok, B.K. Lu, C.W. Ooi, B.L. |
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Conference or Workshop Item |
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Gian, P.W. Shan, X. Liang, Y.N. Lok, B.K. Lu, C.W. Ooi, B.L. |
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Gian, P.W. Shan, X. Liang, Y.N. Lok, B.K. Lu, C.W. Ooi, B.L. High aspect pattern formation by integration of micro inkjetting and electroless plating |
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Gian, P.W. |
title |
High aspect pattern formation by integration of micro inkjetting and electroless plating |
title_short |
High aspect pattern formation by integration of micro inkjetting and electroless plating |
title_full |
High aspect pattern formation by integration of micro inkjetting and electroless plating |
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High aspect pattern formation by integration of micro inkjetting and electroless plating |
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High aspect pattern formation by integration of micro inkjetting and electroless plating |
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high aspect pattern formation by integration of micro inkjetting and electroless plating |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/70466 |
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