Study of the microcracks on the alumina of the thin-film head

Proceedings of the International Symposium on the Physical 7 Failure Analysis of Integrated Circuits, IPFA

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Bibliographic Details
Main Authors: Chekanov, A.S., Low, T.S., Alli, S.
Other Authors: ELECTRICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/72950
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Institution: National University of Singapore

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