A modified button-shear method for measuring fracture toughness of polymer-metal interfaces in IC packages

A modified button-shear method for measuring fracture toughness of polymer-metal interfaces in IC packages

Proceedings - Electronic Components and Technology Conference

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Main Authors: Tay, A.A.O., Phang, J.S., Wong, E.H., Ranjan, R.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73046
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-730462015-03-21T08:54:29Z A modified button-shear method for measuring fracture toughness of polymer-metal interfaces in IC packages Tay, A.A.O. Phang, J.S. Wong, E.H. Ranjan, R. MECHANICAL ENGINEERING Proceedings - Electronic Components and Technology Conference 1165-1169 PECCA 2014-06-19T05:30:33Z 2014-06-19T05:30:33Z 2003 Conference Paper Tay, A.A.O.,Phang, J.S.,Wong, E.H.,Ranjan, R. (2003). A modified button-shear method for measuring fracture toughness of polymer-metal interfaces in IC packages. Proceedings - Electronic Components and Technology Conference : 1165-1169. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/73046 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description Proceedings - Electronic Components and Technology Conference
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Tay, A.A.O.
Phang, J.S.
Wong, E.H.
Ranjan, R.
format Conference or Workshop Item
author Tay, A.A.O.
Phang, J.S.
Wong, E.H.
Ranjan, R.
spellingShingle Tay, A.A.O.
Phang, J.S.
Wong, E.H.
Ranjan, R.
A modified button-shear method for measuring fracture toughness of polymer-metal interfaces in IC packages
author_sort Tay, A.A.O.
title A modified button-shear method for measuring fracture toughness of polymer-metal interfaces in IC packages
title_short A modified button-shear method for measuring fracture toughness of polymer-metal interfaces in IC packages
title_full A modified button-shear method for measuring fracture toughness of polymer-metal interfaces in IC packages
title_fullStr A modified button-shear method for measuring fracture toughness of polymer-metal interfaces in IC packages
title_full_unstemmed A modified button-shear method for measuring fracture toughness of polymer-metal interfaces in IC packages
title_sort modified button-shear method for measuring fracture toughness of polymer-metal interfaces in ic packages
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/73046
_version_ 1681087676268150784

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