A new modified crack surface displacement extrapolation method for analysis of package delamination
Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
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2014
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sg-nus-scholar.10635-730632015-01-08T11:22:35Z A new modified crack surface displacement extrapolation method for analysis of package delamination Guojun, H. Tay, A.A.O. MECHANICAL ENGINEERING Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 PART B 1207-1213 2014-06-19T05:30:44Z 2014-06-19T05:30:44Z 2005 Conference Paper Guojun, H.,Tay, A.A.O. (2005). A new modified crack surface displacement extrapolation method for analysis of package delamination. Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 PART B : 1207-1213. ScholarBank@NUS Repository. 0791842002 http://scholarbank.nus.edu.sg/handle/10635/73063 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| description |
Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Guojun, H. Tay, A.A.O. |
| format |
Conference or Workshop Item |
| author |
Guojun, H. Tay, A.A.O. |
| spellingShingle |
Guojun, H. Tay, A.A.O. A new modified crack surface displacement extrapolation method for analysis of package delamination |
| author_sort |
Guojun, H. |
| title |
A new modified crack surface displacement extrapolation method for analysis of package delamination |
| title_short |
A new modified crack surface displacement extrapolation method for analysis of package delamination |
| title_full |
A new modified crack surface displacement extrapolation method for analysis of package delamination |
| title_fullStr |
A new modified crack surface displacement extrapolation method for analysis of package delamination |
| title_full_unstemmed |
A new modified crack surface displacement extrapolation method for analysis of package delamination |
| title_sort |
new modified crack surface displacement extrapolation method for analysis of package delamination |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/73063 |
| _version_ |
1681087679378227200 |