A numerical analysis of penny-shaped delaminations in an encapsulated silicon module

10.1109/ECTC.2011.5898649

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Bibliographic Details
Main Authors: Ho, S.L., Tay, A.A.O.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73074
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-730742024-11-13T13:23:09Z A numerical analysis of penny-shaped delaminations in an encapsulated silicon module Ho, S.L. Tay, A.A.O. MECHANICAL ENGINEERING 10.1109/ECTC.2011.5898649 Proceedings - Electronic Components and Technology Conference 1115-1121 PECCA 2014-06-19T05:30:52Z 2014-06-19T05:30:52Z 2011 Conference Paper Ho, S.L.,Tay, A.A.O. (2011). A numerical analysis of penny-shaped delaminations in an encapsulated silicon module. Proceedings - Electronic Components and Technology Conference : 1115-1121. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ECTC.2011.5898649" target="_blank">https://doi.org/10.1109/ECTC.2011.5898649</a> 9781612844978 05695503 http://scholarbank.nus.edu.sg/handle/10635/73074 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description 10.1109/ECTC.2011.5898649
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Ho, S.L.
Tay, A.A.O.
format Conference or Workshop Item
author Ho, S.L.
Tay, A.A.O.
spellingShingle Ho, S.L.
Tay, A.A.O.
A numerical analysis of penny-shaped delaminations in an encapsulated silicon module
author_sort Ho, S.L.
title A numerical analysis of penny-shaped delaminations in an encapsulated silicon module
title_short A numerical analysis of penny-shaped delaminations in an encapsulated silicon module
title_full A numerical analysis of penny-shaped delaminations in an encapsulated silicon module
title_fullStr A numerical analysis of penny-shaped delaminations in an encapsulated silicon module
title_full_unstemmed A numerical analysis of penny-shaped delaminations in an encapsulated silicon module
title_sort numerical analysis of penny-shaped delaminations in an encapsulated silicon module
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/73074
_version_ 1821229800495251456