A numerical study of 3D interfacial delamination in PQFP packages
10.1109/EPTC.2009.5416404
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2014
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| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/73079 |
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sg-nus-scholar.10635-730792023-10-30T21:27:07Z A numerical study of 3D interfacial delamination in PQFP packages Ho, S.L. Tay, A.A.O. MECHANICAL ENGINEERING 10.1109/EPTC.2009.5416404 Proceedings of the Electronic Packaging Technology Conference, EPTC 957-963 2014-06-19T05:30:55Z 2014-06-19T05:30:55Z 2009 Conference Paper Ho, S.L., Tay, A.A.O. (2009). A numerical study of 3D interfacial delamination in PQFP packages. Proceedings of the Electronic Packaging Technology Conference, EPTC : 957-963. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2009.5416404 9781424451005 http://scholarbank.nus.edu.sg/handle/10635/73079 000288404200173 Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| description |
10.1109/EPTC.2009.5416404 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Ho, S.L. Tay, A.A.O. |
| format |
Conference or Workshop Item |
| author |
Ho, S.L. Tay, A.A.O. |
| spellingShingle |
Ho, S.L. Tay, A.A.O. A numerical study of 3D interfacial delamination in PQFP packages |
| author_sort |
Ho, S.L. |
| title |
A numerical study of 3D interfacial delamination in PQFP packages |
| title_short |
A numerical study of 3D interfacial delamination in PQFP packages |
| title_full |
A numerical study of 3D interfacial delamination in PQFP packages |
| title_fullStr |
A numerical study of 3D interfacial delamination in PQFP packages |
| title_full_unstemmed |
A numerical study of 3D interfacial delamination in PQFP packages |
| title_sort |
numerical study of 3d interfacial delamination in pqfp packages |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/73079 |
| _version_ |
1781783276709478400 |