A numerical study of fatigue life of copper column interconnections in wafer level packages
Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
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2014
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sg-nus-scholar.10635-730802015-01-13T10:43:02Z A numerical study of fatigue life of copper column interconnections in wafer level packages Sun, W. Tay, A.A.O. Vedantam, S. MECHANICAL ENGINEERING Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 318-323 2014-06-19T05:30:56Z 2014-06-19T05:30:56Z 2004 Conference Paper Sun, W.,Tay, A.A.O.,Vedantam, S. (2004). A numerical study of fatigue life of copper column interconnections in wafer level packages. Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 : 318-323. ScholarBank@NUS Repository. 0780388216 http://scholarbank.nus.edu.sg/handle/10635/73080 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| description |
Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Sun, W. Tay, A.A.O. Vedantam, S. |
| format |
Conference or Workshop Item |
| author |
Sun, W. Tay, A.A.O. Vedantam, S. |
| spellingShingle |
Sun, W. Tay, A.A.O. Vedantam, S. A numerical study of fatigue life of copper column interconnections in wafer level packages |
| author_sort |
Sun, W. |
| title |
A numerical study of fatigue life of copper column interconnections in wafer level packages |
| title_short |
A numerical study of fatigue life of copper column interconnections in wafer level packages |
| title_full |
A numerical study of fatigue life of copper column interconnections in wafer level packages |
| title_fullStr |
A numerical study of fatigue life of copper column interconnections in wafer level packages |
| title_full_unstemmed |
A numerical study of fatigue life of copper column interconnections in wafer level packages |
| title_sort |
numerical study of fatigue life of copper column interconnections in wafer level packages |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/73080 |
| _version_ |
1681087682440069120 |