Adhesive wafer-to-wafer bonding using contact imprinting

10.1117/12.696544

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Bibliographic Details
Main Authors:	Yu, L., Pang, A.J., Chen, B., Tay, F.E.H., Iliescu, C.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Subjects:	Adhesive bonding Contact imprinting SU-8 photoresist Wafer-to-wafer bonding
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73133
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-73133
record_format	dspace
spelling	sg-nus-scholar.10635-731332024-11-13T14:30:18Z Adhesive wafer-to-wafer bonding using contact imprinting Yu, L. Pang, A.J. Chen, B. Tay, F.E.H. Iliescu, C. MECHANICAL ENGINEERING Adhesive bonding Contact imprinting SU-8 photoresist Wafer-to-wafer bonding 10.1117/12.696544 Proceedings of SPIE - The International Society for Optical Engineering 6415 - PSISD 2014-06-19T05:31:32Z 2014-06-19T05:31:32Z 2007 Conference Paper Yu, L., Pang, A.J., Chen, B., Tay, F.E.H., Iliescu, C. (2007). Adhesive wafer-to-wafer bonding using contact imprinting. Proceedings of SPIE - The International Society for Optical Engineering 6415 : -. ScholarBank@NUS Repository. https://doi.org/10.1117/12.696544 0819465232 0277786X http://scholarbank.nus.edu.sg/handle/10635/73133 000245723600045 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Adhesive bonding Contact imprinting SU-8 photoresist Wafer-to-wafer bonding
spellingShingle	Adhesive bonding Contact imprinting SU-8 photoresist Wafer-to-wafer bonding Yu, L. Pang, A.J. Chen, B. Tay, F.E.H. Iliescu, C. Adhesive wafer-to-wafer bonding using contact imprinting
description	10.1117/12.696544
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Yu, L. Pang, A.J. Chen, B. Tay, F.E.H. Iliescu, C.
format	Conference or Workshop Item
author	Yu, L. Pang, A.J. Chen, B. Tay, F.E.H. Iliescu, C.
author_sort	Yu, L.
title	Adhesive wafer-to-wafer bonding using contact imprinting
title_short	Adhesive wafer-to-wafer bonding using contact imprinting
title_full	Adhesive wafer-to-wafer bonding using contact imprinting
title_fullStr	Adhesive wafer-to-wafer bonding using contact imprinting
title_full_unstemmed	Adhesive wafer-to-wafer bonding using contact imprinting
title_sort	adhesive wafer-to-wafer bonding using contact imprinting
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73133
_version_	1821219307004100608

Adhesive wafer-to-wafer bonding using contact imprinting

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