An effective method for calculation of corner stresses with applications to plastic IC packages
Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
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2014
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sg-nus-scholar.10635-731552015-02-28T11:45:03Z An effective method for calculation of corner stresses with applications to plastic IC packages Wei, Z. Meng, L.K. Tay, A. MECHANICAL ENGINEERING Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 534-540 2014-06-19T05:31:48Z 2014-06-19T05:31:48Z 2004 Conference Paper Wei, Z.,Meng, L.K.,Tay, A. (2004). An effective method for calculation of corner stresses with applications to plastic IC packages. Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 : 534-540. ScholarBank@NUS Repository. 0780388216 http://scholarbank.nus.edu.sg/handle/10635/73155 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| description |
Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Wei, Z. Meng, L.K. Tay, A. |
| format |
Conference or Workshop Item |
| author |
Wei, Z. Meng, L.K. Tay, A. |
| spellingShingle |
Wei, Z. Meng, L.K. Tay, A. An effective method for calculation of corner stresses with applications to plastic IC packages |
| author_sort |
Wei, Z. |
| title |
An effective method for calculation of corner stresses with applications to plastic IC packages |
| title_short |
An effective method for calculation of corner stresses with applications to plastic IC packages |
| title_full |
An effective method for calculation of corner stresses with applications to plastic IC packages |
| title_fullStr |
An effective method for calculation of corner stresses with applications to plastic IC packages |
| title_full_unstemmed |
An effective method for calculation of corner stresses with applications to plastic IC packages |
| title_sort |
effective method for calculation of corner stresses with applications to plastic ic packages |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/73155 |
| _version_ |
1681087696244572160 |