An effective method for calculation of corner stresses with applications to plastic IC packages
Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
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Main Authors: | Wei, Z., Meng, L.K., Tay, A. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/73155 |
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Institution: | National University of Singapore |
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