Board level drop test reliability of IC packages

Proceedings - Electronic Components and Technology Conference

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Bibliographic Details
Main Authors:	Chai, T.C., Quek, S., Hnin, W.Y., Wong, E.H., Chia, J., Wang, Y.Y., Tan, Y.M., Lim, C.T.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73233
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-73233
record_format	dspace
spelling	sg-nus-scholar.10635-732332024-11-11T22:05:24Z Board level drop test reliability of IC packages Chai, T.C. Quek, S. Hnin, W.Y. Wong, E.H. Chia, J. Wang, Y.Y. Tan, Y.M. Lim, C.T. MECHANICAL ENGINEERING Proceedings - Electronic Components and Technology Conference 1 630-636 PECCA 2014-06-19T05:32:42Z 2014-06-19T05:32:42Z 2005 Conference Paper Chai, T.C.,Quek, S.,Hnin, W.Y.,Wong, E.H.,Chia, J.,Wang, Y.Y.,Tan, Y.M.,Lim, C.T. (2005). Board level drop test reliability of IC packages. Proceedings - Electronic Components and Technology Conference 1 : 630-636. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/73233 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	Proceedings - Electronic Components and Technology Conference
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Chai, T.C. Quek, S. Hnin, W.Y. Wong, E.H. Chia, J. Wang, Y.Y. Tan, Y.M. Lim, C.T.
format	Conference or Workshop Item
author	Chai, T.C. Quek, S. Hnin, W.Y. Wong, E.H. Chia, J. Wang, Y.Y. Tan, Y.M. Lim, C.T.
spellingShingle	Chai, T.C. Quek, S. Hnin, W.Y. Wong, E.H. Chia, J. Wang, Y.Y. Tan, Y.M. Lim, C.T. Board level drop test reliability of IC packages
author_sort	Chai, T.C.
title	Board level drop test reliability of IC packages
title_short	Board level drop test reliability of IC packages
title_full	Board level drop test reliability of IC packages
title_fullStr	Board level drop test reliability of IC packages
title_full_unstemmed	Board level drop test reliability of IC packages
title_sort	board level drop test reliability of ic packages
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73233
_version_	1821214473853075456

Board level drop test reliability of IC packages

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