Board level drop test reliability of IC packages

• Main Authors: Chai, T.C., Quek, S., Hnin, W.Y., Wong, E.H., Chia, J., Wang, Y.Y., Tan, Y.M., Lim, C.T.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/73233
• Institution: National University of Singapore

Proceedings - Electronic Components and Technology Conference