Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission

• Main Authors: Kim, W., Madhavan, R., Mao, J., Choi, J., Choi, S., Ravi, D., Sundaram, V., Sankararaman, S., Gupta, P., Zhang, Z., Lo, G., Swaminathan, M., Tummala, R., Sitaraman, S., Wong, C.P., Iyer, M., Rotaru, M., Tay, A.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/73407
• Institution: National University of Singapore

Proceedings - Electronic Components and Technology Conference