Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission

Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission

Proceedings - Electronic Components and Technology Conference

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Main Authors: Kim, W., Madhavan, R., Mao, J., Choi, J., Choi, S., Ravi, D., Sundaram, V., Sankararaman, S., Gupta, P., Zhang, Z., Lo, G., Swaminathan, M., Tummala, R., Sitaraman, S., Wong, C.P., Iyer, M., Rotaru, M., Tay, A.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73407
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-734072015-01-07T19:31:33Z Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission Kim, W. Madhavan, R. Mao, J. Choi, J. Choi, S. Ravi, D. Sundaram, V. Sankararaman, S. Gupta, P. Zhang, Z. Lo, G. Swaminathan, M. Tummala, R. Sitaraman, S. Wong, C.P. Iyer, M. Rotaru, M. Tay, A. MECHANICAL ENGINEERING Proceedings - Electronic Components and Technology Conference 2 1506-1512 PECCA 2014-06-19T05:34:44Z 2014-06-19T05:34:44Z 2004 Conference Paper Kim, W.,Madhavan, R.,Mao, J.,Choi, J.,Choi, S.,Ravi, D.,Sundaram, V.,Sankararaman, S.,Gupta, P.,Zhang, Z.,Lo, G.,Swaminathan, M.,Tummala, R.,Sitaraman, S.,Wong, C.P.,Iyer, M.,Rotaru, M.,Tay, A. (2004). Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission. Proceedings - Electronic Components and Technology Conference 2 : 1506-1512. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/73407 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description Proceedings - Electronic Components and Technology Conference
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Kim, W.
Madhavan, R.
Mao, J.
Choi, J.
Choi, S.
Ravi, D.
Sundaram, V.
Sankararaman, S.
Gupta, P.
Zhang, Z.
Lo, G.
Swaminathan, M.
Tummala, R.
Sitaraman, S.
Wong, C.P.
Iyer, M.
Rotaru, M.
Tay, A.
format Conference or Workshop Item
author Kim, W.
Madhavan, R.
Mao, J.
Choi, J.
Choi, S.
Ravi, D.
Sundaram, V.
Sankararaman, S.
Gupta, P.
Zhang, Z.
Lo, G.
Swaminathan, M.
Tummala, R.
Sitaraman, S.
Wong, C.P.
Iyer, M.
Rotaru, M.
Tay, A.
spellingShingle Kim, W.
Madhavan, R.
Mao, J.
Choi, J.
Choi, S.
Ravi, D.
Sundaram, V.
Sankararaman, S.
Gupta, P.
Zhang, Z.
Lo, G.
Swaminathan, M.
Tummala, R.
Sitaraman, S.
Wong, C.P.
Iyer, M.
Rotaru, M.
Tay, A.
Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission
author_sort Kim, W.
title Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission
title_short Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission
title_full Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission
title_fullStr Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission
title_full_unstemmed Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission
title_sort effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/73407
_version_ 1681087742573805568

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