Circular apertures for contact hole patterning in 193nm immersion lithography

• Main Authors: Tay, C.J., Quan, C., Ling, M.L., Lin, Q., Tan, S.K., Chua, G.S.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Subjects: Circular aperture; Contact hole patterning; Diffraction; Immersion lithography; OPC target; Resolution enhancement techniques; Square aperture
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/73250
• Institution: National University of Singapore

10.1117/12.851318